TE Connectivity
TE Connectivity, a world leader in connectivity and sensors, has expanded its VITA 66 optical backplane interconnect family with the new VITA 66.5 Style D optical modules. These high-density modules provide a rugged, blind-mate optical interconnect solution for aerospace, defense, and marine applications.
The VITA 66.5 Style D optical modules feature up to three mechanical transfer (MT) ferrules per insert and a floating receptacle design for optimal alignment. Available in full-size and half-size configurations, they offer versatility for various system designs. The modules are designed to withstand harsh environments and meet military and aerospace specifications.
"The VITA 66.5 Style D, 3 MT optical modules address the growing need for higher data rates and bandwidth in embedded computing applications," says Anders Thelin, Product Manager at TE Connectivity. "This expansion of our VITA 66 family demonstrates our commitment to providing advanced connectivity solutions for challenging environments."
Benefits:
- Easy integration with common mounting interfaces for 3U and 6U VPX applications
- Rugged design based on proven optical termini for various applications
- High performance with up to 3 MT ferrules per insert and floating alignment capability
The VITA 66.5 Style D, 3 MT optical modules are suitable for applications such as embedded computing, secure communications, avionics, radar and imaging systems.