DuPont
DuPont Pyralux ML Series of double-sided metal-clad laminates is an addition to the extensive family of Pyralux laminates for flexible and rigid-flex printed circuit boards (PCBs). Developed for optimal thermal management, these laminates are a solution for high-reliability markets such as aerospace, defense, electric vehicles (EVs), artificial intelligence (AI)-related networking, and other electronic devices. The Pyralux ML laminate series provides exceptional performance in challenging environments, making it a versatile and innovative solution for many different applications.
Laminates serve as the backbone for complex circuits built on both rigid and flexible substrates. They provide mechanical integrity to flex circuits while allowing designers the freedom to fit circuits into the available footprint. The Pyralux ML double-sided metal-clad laminates have been engineered to address the challenges of thermal management and provide optimized performance and are ideally suited for flexible printed circuits, sensors, heaters, and thermocouples deployed in high-reliability applications that can benefit from unique metals with advanced material performance.
Unlike other Pyralux products, the Pyralux ML laminate contains metal alloy, such as copper-nickel (CuNi), featuring Kapton all-polyimide dielectric technology. The alloys provide essential thermal resistance for heating, thermal conductivity to improve the desired heat transfer, resistivity for higher heat output, and thermoelectric properties as needed for the application. Pyralux ML laminates are available in a variety of dielectric and foil types, thicknesses, and a range of metal constructions. The laminates are fully compatible with most conventional circuit fabrication processes, making them a versatile product-development option for OEMs, designers, and fabricators. Pyralux ML double-side clads are currently supplied in sheet form and are being strategically rolled out by DuPont Electronics & Industrial.