Liberty, South Carolina – Ultra-Low-Profile (ULP) series of aluminum electrolytic capacitors from Cornell Dubilier are for applications requiring bulk capacitance and the lowest board profiles. Type ULP offers considerably higher energy density than arrays of surface mount (SMT) capacitors. ULP technology allows the circuit designer to use a single component that saves space, weight, and cost while improving reliability. Developed by Cornell Dubilier, the ULP breaks away from the cylindrical designs usually associated with aluminum electrolytic capacitors.
“With energy density exceeding 0.4 J/cc, a single ULP capacitor provides much greater bulk storage in a smaller footprint than a bank of low-profile SMT capacitors.” claims Mario DiPietro, Product Manager at Cornell Dubilier. “The technology is particularly effective at displacing parallel banks of SMT solid tantalum capacitors to achieve high capacitance on the board.”
Due to its light weight, the ULP is ideal for use in portable devices and is well-suited for a wide range of applications where height profile, board space, and weight are critical design factors. In such situations, the ULP is cost-competitive and it improves circuit reliability through use of a single component versus an entire array of SMT capacitors.
The ULP is offered in package heights of 2.2mm and 3.2mm. Capacitance values range from 500µF to 24,000µF. Working voltages range from 4WVDC to 63WVDC with an operating life of 3,000 hours @ 85°C. Unlike solid tantalum capacitors, type ULP capacitors do not require voltage derating.
Housed in a durable nickel-silver case, the ULP withstands 10g of vibration. Flat ribbon-lead style terminations allow mounting the device off-board to maximize use of available space.